Categories
- STAR MCPCB
- Tri LED MCPCB
- Ø35mm multi LED
- Ø35mm mono LED
- STRIP MCPCB
- Ø40mm multi LED
- Light Engines
- LED optics
- Power supplies
- Thermal adhesive
- Wires
- Heatsinks
- LED reflow assembly
Information
New products
No new product at this time
Design specifications
In order to create your own CAD files, please make sure that it answers the following criteria.
Check out the list below or PDF version :
| PRODUCT RANGE | ||
| Max. board size | 600x600 mm | |
| Board layers | 1 layer | |
| Board thickness | 1.6 mm | |
| Copper thickness | 35 μm | |
| Insulation thickness | 60U"-200U" | |
| Thermal conductivity | 1, 2, 3 W/mk | |
| Breakdown voltage | 2kV AC (0.1mm)-3kV AC (0.15mm) | |
| DESIGN SPECIFICATIONS | ||
| Min. track width | 7.8 mil+/-0.127 | |
| Min. clearance | ||
| Track to pad | 7 mil+/-20% | |
| Pad to pad | 7 mil+/-20% | |
| Track to track | 7 mil+/-20% | |
| Track to hole | 7 mil+/-20% | |
| Track to board edge | 7 mil+/-20% | |
| Min. soldermask expansion | ||
| Min. solderdam | for resist to penetrate between pads | 6 mil |
| Min. drill hole | 1.5 mm | |
| Max. drill hole | 6 mm | |
| Silkscreen | ||
| Min. width | 8 mil | |
| Min. height | 7 mil | |
| Available colors | yellow | |
| black | ||
| white | ||
| V-grooving angle | 30°+/-0,1mm | |
| Card edge chamfer angle | 30°+/-0,1mm | |
| BOARD FINISHING | ||
| Lead free HAL | 30U"-50U" | |
| Heat resist flux (OSP) | 6U"-12U" | |
| Gold plating | 1U"-5U" | |
| Gold flush (electroless : 99.99% Au) | ||
| Gold plating (electrolytic : 99.99% Au) | ||
| Gold bonding (99.9999% Au) | ||
| REPEAT FAB INFORMATION | ||
| Gerber storage (upon last fab) | 5 years |
